Symposium on Reliability for Electronics and Photonics Packaging

Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)
Theme: Reliability for Advanced Semiconductor Packaging

In its fifth year, this major symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging in the context of heterogeneous integration. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.

The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

Details: https://engineering.purdue.edu/ME/News/2024/purdue-university-to-host-semiconductor-reliability-symposium

Register: https://attend.ieee.org/repp/